Updated MIL-HDBK-217 Component Models
As we know, MIL-HDBK-217 has not been updated for quite some time. However it is used frequently in certain industries as a method for predicting reliability. With new technologies and manufacturing processes, component reliability has improved but it has not been reflected in the standard. The end result is very conservative reliability values.
In a highly competitive bidding environment failure rate and mean time between failure values are a critical measure in contract awards. Companies have tried to come up with creative adjustments in their analyses to accurately reflect the expected product life. The Defense Microelectronics Activity (DMEA) was commissioned by the Office of the Secretary of Defense to reverse engineer components within MIL-HDBK-217 and then update the models.
In 2004 the DMEA released Appendix B of the handbook. In collaboration with the DMEA, Item Software incorporated Appendix B into Item ToolKitT. As Dr. Gary Gaugler the Program Manager at the DMEA states, "We were searching for an organization to publish and release these updated models to the public. In an exclusive agreement with Item Software they incorporated our work into their software tools to give their customers the latest component technology in MIL-HDBK-217."
The detailed model allows the user to model with greater accuracy the VHSIC and VLSI/CMOS components within the MIL-HDBK-217F analysis. This in turn leads to a more accurate Failure Rate and MTBF. The detail model goes into greater depth in the physical side of the component and looks into the following areas:
- Common Parameters,
- Oxide Defect,
- Metal Defect,
- Hot Carrier,
- Package Type.
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